IGN Series - Packaging Material for Wafer Shipping Box on Fuji Impulse America

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	IGN Series - Packaging Material for Wafer Shipping Box
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	larger image		IGN series is suitable for packaging hard disc media and silicon wafer etc. to protect them against humidity and particles. It also could be used for packaging containers used for shipping electronic devices such as a tray case that is manufactured and washed inside the cleanroom. Main Feature of IGN Series Manufactured inside the clean room, IGN series achieves high clean level with less dust and particle inside the pouch. By use of Nylon, it has excellent pinhole resistance against piercing and prevents pinhole made by box corner while shipping. Also transparent packaging will help to check the content. There are two sizes available; one for 8-inch and the other for 12-inch size wafer boxes. Composition: ONY/ LDPE

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IGN Series - Packaging Material for Wafer Shipping Box